| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered polyimide film which has heat resistance and surface adhesiveness and of which the coefficient of linear expansion is within a specific range. SOLUTION: The multilayered polyimide film is constituted by laminating a layer (a) comprising a polyamideimide and a layer (b) comprising a polyimide which has at least a pyromellitic acid residue as a residue of an aromatic tetracarboxylic acid and a diamine residue having an oxidianilin (diaminophenyl ether) skeleton as a residue of an aromatic diamine. The thickness ratio (a)/(b) of the layer (a) and the layer (b) is 0.001-0.5 and the thickness of the layer (b) is 3-50μm. The coefficient of linear expansion in the surface direction of the multilayered polyimide film is 10-25 ppm/°C. COPYRIGHT: (C)2008,JPO&INPIT
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