| 发明名称 |
INTERCONNECT STRUCTURE FOR MEMS DEVICE |
| 摘要 |
An iterferometric modulator array (800) is formed with connectors (840) and/or an encapsulation layer (802) with electrical connections. The encapsulation layer hermetically seals the array. Circuitry may also be formed over the array. |
| 申请公布号 |
WO2007087047(A3) |
申请公布日期 |
2007.10.04 |
| 申请号 |
WO2006US48318 |
申请日期 |
2006.12.19 |
| 申请人 |
QUALCOMM INCORPORATED;LASITER, JON, BRADLEY |
发明人 |
LASITER, JON, BRADLEY |
| 分类号 |
G02B26/00 |
主分类号 |
G02B26/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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