| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology to easily and efficiently form conductive portions such as bumps of an electronic component by a method different from screen printing and plating method which have been conventionally used. SOLUTION: This is a method of depositing particles in openings of a resist by dipping a substrate coated with the resist having the openings in a suspension wherein the particles are dispersed. The suspension has such a viscosity as to let the dispersed particles settle and deposit in the openings. This particle deposition method dips the substrate in the suspension, and lets the particles deposit in the openings. By this method, the particles can be evenly deposited in the openings of the substrate in a relatively short time. Furthermore, since excessive particles remaining on the resist can be easily removed, the conductors such as bumps having a desired shape can be formed in the electronic component. COPYRIGHT: (C)2008,JPO&INPIT |
