发明名称 SLIPPERY POLYIMIDE FILM, COPPER-CLAD LAMINATED SUBSTRATE, AND CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a polyimide film having slippery properties advantageous for treatment, and adhesiveness at the production of the polyimide film and the production of an electronic component by using the film. SOLUTION: The slippery polyimide film is characterized by 50-5,000 protrusions having 3-300 nm heights and present on the surface of the film, 0.03-1.0 coefficient of static friction and 0.03-1.0 coefficient of dynamic friction. Especially, the film free from a particle is preferable. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007254643(A) 申请公布日期 2007.10.04
申请号 JP20060082637 申请日期 2006.03.24
申请人 TOYOBO CO LTD 发明人 YOSHIDA TAKESHI;OKUYAMA TETSUO;MAEDA SATOSHI
分类号 C08J5/18;B32B15/08;B32B15/088;C08J7/00;H05K1/03;H05K3/38 主分类号 C08J5/18
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