| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of relaxing a thermal stress generated at the time of bonding, and to provide its manufacturing method. SOLUTION: The semiconductor device 1 comprises an island 10 with a semiconductor chip 90 mounted, a hanging pin 20 with its part bent coupled to and holding the island 10, a resin 30 (a first resin) provided on a flection 22 which is the bent part of the hanging pin 20, and a resin 40 (a second resin) for sealing the semiconductor chip 90. Here, the resin 30 has a glass transition point temperature higher than that of the resin 40. COPYRIGHT: (C)2008,JPO&INPIT
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