| 摘要 |
PROBLEM TO BE SOLVED: To provide a Kelvin-contact type socket for CAN package semiconductor device characteristic inspection, of Kelvin-contacting to two points of the tip of the lead and a side in a CAN package semiconductor device by one continuous rising operation. SOLUTION: In the Kelvin-contact type socket for CAN package semiconductor device characteristic inspection, the socket containing a main contact pin 10 and a side contact pin 9 is built in a fitting seat 1 with a cam mechanism and the side contact pin 9 is opened and closed on the left and the right by the moving cam controlled by a lifting mechanism 8. COPYRIGHT: (C)2008,JPO&INPIT
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