发明名称 |
Mold for resin molding, resin molding apparatus, and semiconductor device manufacture method |
摘要 |
A mold includes a pot for accommodating resin, a cavity for accommodating a semiconductor chip to be resin-molded and a runner as a resin passage for transporting the resin accommodated in the pot to the cavity. A foreign matter retention pocket is disposed which is a recess formed by digging further a partial inner surface of the runner. A runner magnet attracts and attaches a metallic foreign matter contained in fluid transported in the runner to the inner surface of the foreign matter retention pocket.
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申请公布号 |
US2007231956(A1) |
申请公布日期 |
2007.10.04 |
申请号 |
US20070655882 |
申请日期 |
2007.01.22 |
申请人 |
FUJITSU LIMITED |
发明人 |
FUKAYA FUTOSHI;KATOH YOSHITSUGU |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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