发明名称 |
MANUFACTURING METHOD FOR SEMICONDUCTOR CHIPS AND SEMICONDUCTOR WAFER |
摘要 |
In a semiconductor wafer that has semiconductor devices arranged in a plurality of device-formation-regions and a TEG placed in dividing regions that define the device-formation-regions, a TEG-placement portion is arranged in the dividing regions partially expanded in width, and the TEG is placed in the TEG-placement portion. Additionally, a protective sheet is stuck to the semiconductor wafer, then plasma etching is performed, and the TEG is removed in a state where it remains in the dividing region and stuck to the protective sheet together with the protective sheet by peeling off the protective sheet, thereby the device-formation-regions are divided into individual pieces, and the semiconductor chips are manufactured. |
申请公布号 |
EP1839333(A2) |
申请公布日期 |
2007.10.03 |
申请号 |
EP20060711691 |
申请日期 |
2006.01.10 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
ARITA, KIYOSHI;NISHINAKA, TERUAKI |
分类号 |
H01L21/78;H01L21/68;H01L23/544 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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