| 摘要 |
A process is provided whereby thick platings such as bumps and wirings are produced with high precision while a resist shows high swelling resistance to a plating solution and the plating solution is prevented from leaking in between the pattern and substrate. A radiation-sensitive negative resin composition shows high sensitivity in the production process and possesses excellent resolution and heat resistance. A transfer film includes the composition. The radiation-sensitive negative resin composition includes (A) a polymer including a structural unit represented by Formula (1) and a structural unit represented by Formula (2) ; (B) a compound having at least one ethylenically unsaturated double bond; and (C) a radiation-sensitive radical polymerization initiator;
wherein R 1 is a hydrogen atom or a methyl group; R 2 is a linear, cyclic or aromatic hydrocarbon group of 6 to 12 carbon atoms, or a substituted hydrocarbon group wherein at least one hydrogen atom in the linear, cyclic or aromatic hydrocarbon group is substituted with a hydrocarbon group; R 3 is a hydrogen atom or a methyl group; R 4 is -(C n H 2n )-; m is an integer of 1 to 10; and n is an integer of 2 to 4.
|
