| 摘要 |
PROBLEM TO BE SOLVED: To obtain a solvent type silicone composition for mold release agent having a curing rate higher than that of the conventional one, providing a cured coating film with a light peel at a high-speed peel, having a slight change in peel force with time of cured coating film, a readily adjustable peel force, being readily handled and even in the case of using a substrate with low heat resistance such as a plastic film as a substrate for a release paper, exhibiting an excellent adhesion to the substrate. SOLUTION: This solvent type silicone composition for mold release agent comprises (A) a branched organopolysiloxane which contains two or more alkenyl groups in one molecule and has a structure represented by the general formula: M<1> a Tb Dc M<2> d , (B) an organohydrogenpolysiloxane containing three or more hydrogen atoms bonded to silicon atoms in one molecule, (C) a catalytic amount of a platinum-based catalyst, (D) an addition reaction inhibitor and (E) an organic solvent. |
