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发明名称
ELECTRICAL DETERMINATION OF THE CONNECTION QUALITY OF A BONDED WAFER CONNECTION
摘要
申请公布号
EP1839331(A2)
申请公布日期
2007.10.03
申请号
EP20060722452
申请日期
2006.01.09
申请人
X-FAB SEMICONDUCTOR FOUNDRIES AG
发明人
KNECHTEL, ROY
分类号
H01L21/66
主分类号
H01L21/66
代理机构
代理人
主权项
地址
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