发明名称 |
METHOD OF FORMING CARBON POLYMER FILM USING PLASMA CHEMICAL VAPOR DEPOSITION |
摘要 |
A method for forming a carbon polymer film using plasma chemical vapor deposition is provided to reduce an extinction of coefficient of a hydrocarbon-containing polymer film by 193nm, thereby increasing mechanical hardness thereof. A hydrocarbon-containing liquid monomer having a boiling point of 20°C to 350°C which is not substituted by a vinyl group or an acetylene group is vaporized. The vaporized gas and CO2 gas or H2 gas are introduced into a chemical vapor deposition reaction chamber(11) in which a substrate(1) is located. A hydrocarbon-containing polymer film is formed on the substrate by plasma polymerization of the gas. A flow rate of the CO2 gas or H2 gas is controlled so that the film has an extinction coefficient of up to 0.38 at 193nm and a mechanical hardness of 0.5GPa or more.
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申请公布号 |
KR20070096770(A) |
申请公布日期 |
2007.10.02 |
申请号 |
KR20060111032 |
申请日期 |
2006.11.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;ASM JAPAN K.K. |
发明人 |
BAEK, EUN KYUNG;NA, KYU TAE;MASASHI YAMAGUCHI;NOBUO MATSUKI;YOSHINORI MORISADA;KAMAL KASHORE GOUNDAR |
分类号 |
H01L21/205 |
主分类号 |
H01L21/205 |
代理机构 |
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