Expandable bracing apparatus and method

摘要

A bracing apparatus is disclosed that has a component located within an opening in a cantilevered end of a heatsink. The component has a form factor that is expandable for stabilizing the heatsink at a given elevation relative to a printed circuit board. The bracing apparatus includes a tensioning device located within an opening in the component. When deployed, the tensioning device causes the component to expand. Also included in the bracing apparatus is a coupling medium for coupling the component to the printed circuit board.