| 摘要 |
<p>The invention relates to a multilayer body (11, 12) comprising a replicating varnish layer (22). A first relief structure (25, 125, 65) is moulded into said replicating varnish layer (22) on a plane defined by coordinate axes x and y in the first area of the multilayer body and an electroconductive constant surface-density coating (23I, 23n, 123n) is applied to the replicating varnish layer (22) in the first area of the multilayer body (11, 12) and in the second adjacent area thereof. The first relief structure (25, 125, 65) is embodied in such a way that different structural elements thereof have a high depth/width ratio, in particular >2. At least one perpendicular or near-to-perpendicular flank extends along the entire or near-to-entire depth of the relief structure, thereby reducing or removing the coating electrocunductivity.</p> |
