发明名称 |
Submount for light emitting device |
摘要 |
A submount for a light emitting device package is provided. The submount includes a substrate; a first bonding layer and a second bonding layer which are separately formed on the substrate; a first barrier layer and a second barrier layer which are formed on the first bonding layer and on the second bonding layer, respectively; a first solder and a second solder which are formed on the first barrier layer and on the second barrier layer, respectively; and a first blocking layer and a second blocking layer which are formed around the first barrier layer and the second barrier layer, blocking the melted first solder and the melted second solder from overflowing during a flip chip process. |
申请公布号 |
US7276740(B2) |
申请公布日期 |
2007.10.02 |
申请号 |
US20060372204 |
申请日期 |
2006.03.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM HYUNG-KUN;CHAE SU-HEE;JANG TAE-HOON |
分类号 |
H01L33/62 |
主分类号 |
H01L33/62 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|