| 摘要 |
A PCB(Printed Circuit Board) for high frequency impedance matching and a manufacturing method thereof are provided to enable impedance matching by forming a second ground layer with an auxiliary material to reduce the distance between a signal line and a ground. A PCB for high frequency impedance matching includes a core layer(30), a signal layer(31), a first ground layer(32), a second ground layer(33) and an insulating layer(34). The core layer(30) is made of an insulating material and an adhesive. The signal layer(31) forms a signal line on one surface of the core layer(30). The first ground layer(32) forms a ground on the other surface of the core layer(30). The second ground layer(33) is formed in a specific signal line section of the signal line formed on the signal layer(31), and is electrically connected to the first ground layer(32). The insulating layer(34) insulates between the signal layer(31) and the second ground layer(33).
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