发明名称 |
SEMICONDUCTOR PACKAGE PREVENTING THE STATIC ELECTRICITY |
摘要 |
A semiconductor package is provided to improve remarkably ESD characteristics by preventing the degradation of the ESD characteristics in spite of the fineness of a semiconductor device using a conductive bar vertically arranged to a predetermined structure with a conductive pattern. A semiconductor package includes a predetermined structure, a conductive network, at least one conductive bar, and a ground portion. The predetermined structure has a conductive pattern. The conductive network(102) is attached to one surface of the predetermined structure. The conductive bar(110) is vertically arranged to the conductive network to absorb the static electricity of the outside. The ground portion(120) is used for emitting the static electricity electrically transmitted from the conductive network to the outside. |
申请公布号 |
KR100761861(B1) |
申请公布日期 |
2007.09.28 |
申请号 |
KR20060098865 |
申请日期 |
2006.10.11 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, HEE SEOK;CHOI, YUN SEOK;SONG, EUN SEOK |
分类号 |
H01L23/60 |
主分类号 |
H01L23/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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