| 摘要 |
AN ARRANGEMENT OF PADS (14, 20, 22) WITH SELECTIVE VIA (24) IN PAD (14, 20, 22) FOR MOUNTING A SEMICONDUCTOR PACKAGE (12) ON A SUBSTRATE (18).IN ORDER TO STRENGTHEN THE SOLDERED BONDS, STANDARD PADS (14, 20, 22), WHICH HAVE A STRONGER BOND, ARE USED IN LOCATIONS OF GREATEST STRESS AND DEFLECTION. VIAS (24) IN PAD (VIP) ARE USED AT ALL OTHER LOCATIONS TO IMPROVE ROUTING ADVANTAGES DUE TO THEIR SMALLER SURFACE AREA.(FIG 3) |
