METHOD FOR FORMING REINFORCED INTERCONNECTS ON A SUBSTRATE
摘要
A method for forming reinforced interconnects or bumps on a substrate includes first forming a support structure on the substrate. A substantially filled capsule is then formed around the support structure to form an interconnect. The interconnect can reach a height of up to 300 microns.
申请公布号
SG135172(A1)
申请公布日期
2007.09.28
申请号
SG20070017080
申请日期
2007.03.06
申请人
FREESCALE SEMICONDUCTOR, INC.
发明人
SHIU, HEI MING;CHAU, ON LOK;LAI, GOR AMIE;YIP, HENG KEONG;CHANG, THOON KHIN;TAN, LAN CHU
