发明名称 |
ELECTROPROCESSING PROFILE CONTROL |
摘要 |
A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially outward of substrate with a polarity opposite the bias applied to the first electrode.
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申请公布号 |
KR20070095396(A) |
申请公布日期 |
2007.09.28 |
申请号 |
KR20077018157 |
申请日期 |
2007.08.07 |
申请人 |
APPLIED MATERIALS INC. |
发明人 |
MANENS ANTOINE P.;GALBURT VLADIMIR;WANG YAN;DUBOUST ALAIN;OLGADO DONALD J.K.;CHEN LIANG YUH |
分类号 |
B24D99/00;B24B37/04;H01L21/304;H01L21/321 |
主分类号 |
B24D99/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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