发明名称 ELECTROPROCESSING PROFILE CONTROL
摘要 A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially outward of substrate with a polarity opposite the bias applied to the first electrode.
申请公布号 KR20070095396(A) 申请公布日期 2007.09.28
申请号 KR20077018157 申请日期 2007.08.07
申请人 APPLIED MATERIALS INC. 发明人 MANENS ANTOINE P.;GALBURT VLADIMIR;WANG YAN;DUBOUST ALAIN;OLGADO DONALD J.K.;CHEN LIANG YUH
分类号 B24D99/00;B24B37/04;H01L21/304;H01L21/321 主分类号 B24D99/00
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