STACK SEMICONDUCTOR PACKAGE HAVING INTERPOSER CHIP FOR ENABLING WIRE BOND MONITORING, AND FABRICATION METHOD USING THE SAME

摘要

A stacked semiconductor package and its manufacturing method are provided to monitor easily a wire bonding state by using a diode or a capacitor with a polarity and a current flow as a circuit element of an interposer chip. A stacked semiconductor package includes a circuit board, a first semiconductor chip wire-bonded to the circuit board, an interposer chip, and a second semiconductor chip. The interposer chip(24) is formed on the first semiconductor chip. The interposer chip is wire-bonded with the circuit board. The second semiconductor chip is formed on the interposer chip. The second semiconductor chip is wire-boned with the interposer chip to be electrically connected with the circuit board through the interposer chip. The interposer chip has a circuit element with a polarity and a current flow. A diode(54) or a capacitor are used as the circuit element of the interposer chip.