| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic circuit module having such a structure as cracking does not take place in a ceramic substrate around a pad electrode, and to provide a method of manufacturing the same. <P>SOLUTION: The ceramic circuit module 20 comprises a ceramic substrate (ceramic circuit board) 11 mounting a semiconductor element, and the like, a ceramic substrate pad electrode (pad) 12 provided on the surface of the ceramic substrate 11, and a glass protective film 13 covering the surface of the ceramic substrate 11 located around the pad and covering the outer circumference of the pad 12. At the part where the pad 12 and the glass protective film 13 overlap, the outer circumferential part of the pad 12 is shaped to sink to the ceramic substrate 11 side along the backside of the glass protective film 13. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
