发明名称 SEALING STRUCTURE FOR LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD, LIGHT EMITTING DEVICE, AND ELECTRONIC DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To improve sealing performance in a sealing structure for a light emitting device such as an organic EL (electroluminescence) device, and also to provide its manufacturing method, and the light emitting device having the sealing structure. <P>SOLUTION: The sealing structure for the light emitting device is provided with a sealing substrate 20, which is arranged so as to face an element substrate 10, of which a side opposite to the element substrate is formed in a recessed shape for housing a light emitting element, and which includes an anisotropic part with higher flexibility in a direction along a longitudinal direction of the element substrate than in a direction along a lateral direction of the element substrate, and a sealing material 52 for bonding the element substrate and an opposite substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007250355(A) 申请公布日期 2007.09.27
申请号 JP20060072301 申请日期 2006.03.16
申请人 SEIKO EPSON CORP 发明人 MIYAZAWA HIDEAKI
分类号 H05B33/04;B41J2/44;B41J2/45;B41J2/455;H01L51/50;H05B33/10 主分类号 H05B33/04
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