| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal/resin laminate hard to cause the warpage of a laminate composed of a resin layer and a metal layer or the peel of both layers of the laminate and usable in the insulating substrate or insulating radiation plate of an element or a package. SOLUTION: The metal/resin laminate is the laminate composed of the metal layer low in thermal expansion and the polyimide resin layer and characterized in that the coefficient of average liner expansion at 30-200°C is -5 to +10 ppm/°C. The coefficient of average liner expansion of the metal layer low in thermal expansion at 30-200°C is -5 to +10 ppm/°C and the coefficient of average liner expansion of the polyimide resin layer at 30-200°C is -5 to +10 ppm/°C. COPYRIGHT: (C)2007,JPO&INPIT |
