| 摘要 |
A cycle of electroplating is repeated in an electroplating bath containing at least one metal ion selected from cobalt, nickel and iron, a buffering agent and a conducting agent by use of a soluble anode. The concentration of the conducting agent in an initially prepared electroplating bath is set at 70 to 95% of a saturated concentration. The electroplating is repeated in such a way that a first replenishment solution containing a buffering agent and a conducting agent at concentrations of 0.5 to 1.2 times the concentrations in the initially prepared electroplating bath and free of the metal ion is added so as to replenish the agents that have been reduced in amount during the course of the electroplating and a concentration of the conducting agent in the electroplating bath after the replenishment of the first replenishment solution is adjusted to 70 to 95% of a saturated concentration thereof. According to the invention, the electroplating can be repeated while keeping the electroplating bath over a long time in a good condition sufficient to provide a plated film having high throwing power and a good appearance, so that there can be stably obtained plated films over a long time without frequent regeneration such as by electrolysis for lowering the concentration of a metal ion in the plating bath, thus being good at economy.
|
