发明名称 Zn ion implanting method of nitride semiconductor
摘要 A method of implanting a zinc (Zn)-ion into a nitride-based semiconductor substrate, the method includes: providing a homogeneous substrate on which a gallium nitride layer is grown; placing the homogeneous substrate in a crucible in which gallium nitride powders are coated; placing the crucible into a furnace; and performing a heat treatment process, so that a Zn-ion implantation is performed under an ammoniacal atmosphere in the furnace. The method of implanting a Zn-ion into a nitride-based semiconductor substrate, which can minimize a decomposition of a gallium nitride layer during a heat treatment process at a high temperature, easily produce a p-type, and reduce contact resistance between a semiconductor and a metal electrode, is provided.
申请公布号 US2007224790(A1) 申请公布日期 2007.09.27
申请号 US20070723581 申请日期 2007.03.21
申请人 SAMSUNG CORNING CO., LTD. 发明人 KIM CHONG-DON
分类号 H01L21/04;H01L21/265;H01L21/324 主分类号 H01L21/04
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