| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive curing device for adequately curing an adhesive even when curing conditions of the adhesive change. SOLUTION: The adhesive curing device 16 which cures the adhesive S by irradiating a substrate W, formed by laminating substrates together across the photosetting adhesive, with curing light includes a substrate stage 51 on which the laminated substrate W is mounted, a light irradiating means 40 of irradiating the laminated substrate W on the substrate stage 51 with the curing light, a light shield mask 67 arranged right above the substrate stage 51, a mask stage 66 holding the light shield mask 67, and a Z-axial table 65 which moves up and down the mask stage 66 relatively to the substrate stage 51 to adjust the distance between the laminated substrate W and light shield mask 66. COPYRIGHT: (C)2007,JPO&INPIT
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