| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for an electronic material that has an appropriately adhesive force at positioning, shows sufficient fluidity when pasted to an object by hot laminating or pressing, and shows high reflow resistance and high thermal cycle characteristics when thermally solidified. SOLUTION: The adhesive sheet for the electronic material comprises at least an adhesive layer and an organic insulating film layer. The adhesive layer contains at least one kind among (A) thermoplastic resin, (B) crystalline epoxy resin of a melting point 70-150°C, and (C) inorganic particles. At least one kind of the (A) thermoplastic resin has weight-averaged molecular weight 200,000-1,000,000, while the median diameter of the (C) inorganic particles is 0.1-2μm. COPYRIGHT: (C)2007,JPO&INPIT
|
