发明名称 HEAT REMOVING DEVICE OF ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat removing device without producing dew condensation. SOLUTION: A water supplying mechanism 5 is located on a bottom of inside space of a closed apparatus case, and a heat conduction substrate 6 fixing electronic members 2 is mounted on the water supplying mechanism 5, and an inside temperature sensor of electronic apparatus 7 responsive to the apparatus inside temperature and a thermovalves 8 interlocking with the inside temperature sensor of apparatus 7 are located on the parts of the electronic apparatus, and the thermovalves 8 are attached on both ends of supply/exhaust of the water supplying mechanism 5 respectively, and an amount of flowing water passing through the water supplying mechanism 5 is controlled correspondent to the apparatus inside temperature, and the apparatus inside temperature, the temperature of flowing water, and the atmosphere temperature around the electronic member are controlled at the same temperature, whereby, the dewing inside the electronic apparatus can be prevented. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007251109(A) 申请公布日期 2007.09.27
申请号 JP20060107999 申请日期 2006.03.14
申请人 DAIHAN:KK;TOKYO ELECTRIC POWER CO INC:THE 发明人 UEMURA MOTOAKI;UEMURA SHINOBU;ISHII HIDEO;SUGITA KATSUHIKO
分类号 H05K7/20 主分类号 H05K7/20
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