发明名称 |
Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device |
摘要 |
According to one embodiment, there is provided a printed-wiring board with a component in which an electronic component is mounted on a pattern-forming surface of a base material. In the printed-wiring board, a guiding path for guiding, to the outside, a void formed in mounting the electronic component is formed on the pattern-forming surface.
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申请公布号 |
US2007221398(A1) |
申请公布日期 |
2007.09.27 |
申请号 |
US20070701816 |
申请日期 |
2007.02.01 |
申请人 |
TOSHIBA AMERICA INFORMATION SYSTEMS, INC. |
发明人 |
KARASAWA JUN;SUZUKI DAIGO;TANAKA HIDENORI |
分类号 |
H05K1/00;H05K3/30 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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