SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

摘要

A semiconductor device and a method for forming the same are provided to obtain an optimized structure of a semiconductor chip for a stacking process by using a pillar type terminal and a pad type terminal. A semiconductor device includes a semiconductor chip. The semiconductor chip is composed of a first chip substrate, a second chip substrate, pillar type terminals and pad type terminals. The first chip substrate has first and second surfaces opposite to each other. The first chip substrate is made of semiconductor. The second chip substrate has a second lateral portion contacting a first lateral portion of the first chip substrate, third and forth surfaces opposite to each other. The second chip substrate is made of insulator. The pillar type terminals(126a,126b) are formed through the second chip substrate. The pad type terminals are arranged on the third surface of the second chip substrate.