发明名称 PLATING MATERIAL AND ELECTRICAL AND ELECTRONIC COMPONENT USING THE PLATING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a plating material adequate for sliding parts of connection terminals and the like, and electric and electronic components of a fitting type multipolar connector and the like improved in insertion and removal properties by using the plating material. SOLUTION: A plating material 5 is provided with a base layer 2 of Ni or the like on a conductive base body 1, an intermediate layer 3 of copper or a copper alloy thereon, and an outermost layer 4 composed of a Cu-Sn intermetallic compound thereon. When the plating material 5 is used for a sliding surface of a terminal or the like, the outermost layer 4 is composed of the rigid Cu-Sn intermetallic compound and therefore, even if the contact pressure between the terminals and the like is made smaller, a fretting phenomenon hardly occurs. Accordingly, the insertion and removal properties of the terminals using the plating material 5 on the sliding surface can be enhanced by making the plating layer thinner. The plating material 5 is prevented from the thermal diffusion of the fundamental components during production or during use by the base layer 2 and the thermal diffusion of the base layer components is obstructed by the intermediate layer 3 and therefore, the contamination of the Cu-Sn intermetallic compound layer of the outermost layer 4 is averted and the functions thereof are satisfactorily maintained. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007247060(A) 申请公布日期 2007.09.27
申请号 JP20070038697 申请日期 2007.02.19
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 YOSHIDA KAZUO;SUZAI KYOTA
分类号 C25D7/00;C22C9/02;C22C13/00;C23C8/10;C23C28/00;C25D5/10;C25D5/12;C25D5/50 主分类号 C25D7/00
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