发明名称 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device having a film with a flat surface on the surface of a semiconductor substrate having a convex on this surface wherein the thickness of the film is less than the height of the convex. SOLUTION: This manufacturing method comprises the steps of depositing a silicon oxide film 450 on the surface of the semiconductor substrate 100 having the convex 300 on this surface according to high density plasma chemical vapor deposition and etching the silicon oxide film according to isotropic etching so that the deposited silicon oxide film has a height less than that of the summit of the convex portion. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007250782(A) |
申请公布日期 |
2007.09.27 |
申请号 |
JP20060071357 |
申请日期 |
2006.03.15 |
申请人 |
SHARP CORP;MASUOKA FUJIO |
发明人 |
HORII SHINJI;YOKOYAMA TAKASHI;MASUOKA FUJIO |
分类号 |
H01L23/522;H01L21/306;H01L21/316;H01L21/336;H01L21/768;H01L29/78 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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