| 摘要 |
PROBLEM TO BE SOLVED: To provide a heating and cooling module, mounted with a semiconductor and capable of raising a calorific value of a heating heater and preventing damages, even if it is heated and cooled in a short time. SOLUTION: The heating and cooling module comprises a ceramic heater for mounting an object to be treated and heating it, a cooling mechanism for cooling the ceramic heater, and a support between the ceramic heater and the cooling mechanism. The ceramic heater is an aluminum nitride heater, having one exothermic layer or more in the inside. It is desirable that it has an intervening layer between the ceramic heater and the support. It is desirable that an intervening layer exist between the support and the cooling mechanism. COPYRIGHT: (C)2007,JPO&INPIT
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