| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin material for an optical fiber array, the material hardly causing peeling of a resin layer or the like due to curing shrinkage even when the film thickness of a resin layer comprising the resin material is set to as thick as 150μm or more. SOLUTION: The resin material for an optical fiber array contains a photopolymerizable compound and a photoinitiator and is characterized in that the material contains two kinds of spherical silica subjected to surface treatment with a silane coupling agent, by 70 to 85 wt.%, and the average particle sizes of the silica are 0.3 to 4μm and 8 to 15μm, respectively. As two kinds of spherical silica having average particle sizes of 0.3 to 4μm and 8 to 15μm are mixed for use, the curing shrinkage can be controlled to, for example, less than 2%. Even when a resin layer to be cured is formed into a thick film having a thickness of 150μm or more, peeling of the resin layer due to curing shrinkage can be avoided. COPYRIGHT: (C)2007,JPO&INPIT
|
