| 摘要 |
Compositions for improved liquid deposition of active material in manufacturing processes of electronic devices are provided. The compositions comprise at least one active material for liquid deposition, at least one first solvent, at least one second solvent, and at least one third solvent, with a fourth solvent optional. The solvents are selected on the basis of their co-miscibility, ability to form a composition with each other and with active material without significant precipitation of active material from the composition, and at least one of the solvents having a surface tension equal to or less than that of the substrate upon which active material is to be deposited. |
