| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a metalized ceramic substrate having a wiring pattern with high density, high definition, and high conductivity. <P>SOLUTION: The method for manufacturing the metalized ceramic substrate includes: a process for forming a conductive paste layer by applying conductive paste on a ceramic sintered base material, which contains metal powder and an organic binder to be soluble in a developer; a process for forming a photo-resist layer on the conductive paste layer; a process for forming a resist pattern to be insoluble in the developer by radiating light to a desired position on the photo-resist layer; a process for forming a desired conductive paste pattern by removing a photo-resist other than the resist pattern and the conductive paste in the lower part of the photo-resist other than the resist pattern through the use of the developer; and a process for forming the wiring pattern by removing the resist pattern by calcining, and sintering a conductive paste pattern. <P>COPYRIGHT: (C)2007,JPO&INPIT |
