| 发明名称 |
THERMO-SETTING RESIN COMPOSITION, LIGHT TRANSMITTING CURED PRODUCT OBTAINED BY THERMOSETTING THE SAME, AND LIGHT EMITTING DIODE SEALED WITH THE CURED PRODUCT |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermo-setting resin composition giving a cured product excellent in UV ray resistance and heat resistance and also provide a light emitting diode using the composition as a sealing agent. <P>SOLUTION: The thermo-setting resin composition comprises trimethylolpropane polyglycidyl ether and hydrogenated trimellitic acid anhydride, and the light emitting diode is obtained by using the composition as a sealing agent. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| 申请公布号 |
JP2007246830(A) |
申请公布日期 |
2007.09.27 |
| 申请号 |
JP20060074999 |
申请日期 |
2006.03.17 |
| 申请人 |
STANLEY ELECTRIC CO LTD |
发明人 |
SUGINO HIROAKI |
| 分类号 |
C08G59/42;G02B1/04;H01L33/50;H01L33/56 |
主分类号 |
C08G59/42 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
