| 摘要 |
PROBLEM TO BE SOLVED: To secure high reliability even in a vertical packed multi-chip package in which a plurality of semiconductor chips are stacked. SOLUTION: The semiconductor device 34 provided with a specified circuit pattern includes a lower layer semiconductor chip (a first semiconductor chip) 36, in which a digital circuit, for example, is formed, and an upper layer semiconductor chip (a second semiconductor chip) 37, in which an analogue circuit is formed, stacked through a heat transmitting conductive sheet (heat transmitting conductor) 38 with their circuit formed sides facing each other on a substrate 35, on which a lattice of ball-shaped bumps 35a, 35a, ... is formed, and sealed with molded resin 39. COPYRIGHT: (C)2007,JPO&INPIT
|
