发明名称 ETCHING METHOD
摘要 An etching apparatus is described, including an etching chamber, a gas pipe, a gas distribution plate and a heater. The gas pipe is disposed above the etching chamber for delivering a gas to the exterior surface of the etching chamber. The gas distribution plate is disposed at the outlet of the gas pipe, including a plate body and an inner collar-shaped part thereon facing the outlet of the gas pipe. The inner collar-shaped part and the portion of the plate body around the inner collar-shaped part each has multiple through holes therein. The heater is disposed around the space between the gas pipe and the etching chamber for heating the gas flowing out of the gas distribution plate.
申请公布号 US2007221618(A1) 申请公布日期 2007.09.27
申请号 US20070755755 申请日期 2007.05.31
申请人 UNITED MICROELECTRONICS CORP. 发明人 HSIEH CHUAN-HAN;LIU YU-MING;LI CHIU-LIANG;HSU HUI-CHIN;YEH KUO-CHIH;CHENG HUNG-TE;HSU CHIEN-EN
分类号 C03C25/68;B44C1/22 主分类号 C03C25/68
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