摘要 |
<p>The present invention relates to a light emitting diode (LED) module (10) comprising an LED (14) chip for emitting light, which LED chip is mounted on a substrate (12), and an optical element (16) positioned on top of the LED chip for converting the wavelength of at least part of the light emitted from the LED chip. The LED module is characterized by means (18, 20, 22, 24, 26, 28, 32, 34) for laterally and angularly aligning the optical element with the LED chip. The alignment means ensure that the optical element automatically aligns itself to the LED chip when it is placed on the chip, and that the correct position and orientation of the optical element is maintained during subsequent manufacturing and operation of the LED module. The present invention also relates to a method for the manufacturing of such an LED module.</p> |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V.;BRUNNER, KLEMENS;WEIJERS, ALDEGONDA, L.;SWEEGERS, NORBERTUS, A., M.;VISSER, CORNELIS, G. |
发明人 |
BRUNNER, KLEMENS;WEIJERS, ALDEGONDA, L.;SWEEGERS, NORBERTUS, A., M.;VISSER, CORNELIS, G. |