| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device with an air bubble hardly left at the connection part with a semiconductor element with a plurality of electrode terminals formed along a peripheral border in a region having a predetermined width along the peripheral border except a central part formed flip chip connected to one surface side of a substrate, and hardly left at an under fill material for sealing its vicinity. <P>SOLUTION: The semiconductor device with the semiconductor element 10 with the plurality of electrode terminals 16 formed along the peripheral border in the region having the predetermined width along the peripheral border except the central part and its vicinity mounted on a pad-forming surface of the substrate 12 with pads 14 corresponding to each of the electrode terminal 16 formed, and with the connection part 26 between the semiconductor element 10 and the substrate 12 sealed by the under fill material 24. A dam 20 for surrounding an inner region 28 is formed so that the connection part region having the connection part 26 and the region 28 further inner than the connection part region are divided, the connection part region is sealed by the under fill material 24, and a plurality of through-holes 22 passing through the substrate 12 are formed in the region 28 of the substrate 12 surrounded by the dam 20. <P>COPYRIGHT: (C)2007,JPO&INPIT |
