| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a circuit board planning to improve a heat dissipation. <P>SOLUTION: The semiconductor device 10 is equipped with: a semiconductor chip 11 provided with a primary principal plane on which a first electrode is arranged and a secondary principal plane on which a second electrode is arranged; a primary electrode terminal 12 which is arranged on the primary principal plane and is electrically connected with the first electrode and is thermally connected with the semiconductor chip 11; secondary electrode terminals 13, 14; a primary section which is arranged on the secondary principal plane and is electrically connected with the second electrode; a secondary section which electrically connects the primary section with the secondary electrode terminals 13, 14; and a tertiary section which is electrically connected with primary sections 13A, 14A. Moreover, the semiconductor device 10 is equipped with a sealing member 17 which seals connectors 15, 16 constituted by a conductive material, the semiconductor chip 11, the primary section 1 and the secondary section and exposes at least a part of the tertiary section as an electrode terminal. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
