发明名称 LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To obtain a laminated electronic component with good attenuation characteristics as free from affecting coil elements or capacitive elements each other. SOLUTION: The laminated electronic component has a laminate formed by laminating a plurality of insulating substrates, and includes an insulating substrate M6 with an electrode pattern 105 forming a first coil element L1, and an electrode pattern 106 disposed apart from the electrode pattern 105 and forming a second element L2 having one end connected to one end of the electrode pattern 105, and a second insulating substrate M5 where an electrode pattern 113 is formed for connecting the one end of the electrode pattern 105 and the one end of the electrode pattern 106 to each other. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007250941(A) 申请公布日期 2007.09.27
申请号 JP20060074034 申请日期 2006.03.17
申请人 NGK SPARK PLUG CO LTD 发明人 SUEHIRO TETSUDAI;TAKAGI KEIJI;ICHIKAWA JUNICHI;FUKUNAGA KAZUNORI;MURAKAMI KATSUHISA
分类号 H01F17/00;H01F17/04;H01F27/00;H01F27/29;H03H7/075 主分类号 H01F17/00
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