发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To miniaturize a transformer housing chamber by suppressing heating of the transformer and preventing degradation due to heat of the transformer and peripheral parts. SOLUTION: The substrate processing apparatus comprises a process chamber for processing a substrate, a heating device for heating the process chamber, a power supply line which is connected to the heating device, a transformer provided on the power supply line, and a transformer housing chamber for housing the transformer. The transformer housing chamber comprises a first cooling gas supply means which supplies cooling gas into the transformer housing chamber, a cooling gas flow path which guides the cooling gas supplied in the transformer housing chamber to supply it to a local place in the transformer housing chamber, and a second cooling gas supply means which supplies the cooling gas having been supplied to the local place to the transformer. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007250802(A) 申请公布日期 2007.09.27
申请号 JP20060071811 申请日期 2006.03.15
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 KAGAYA TORU;MIYASHITA TOMOYASU
分类号 H01L21/205;H01F27/08;H01L21/22;H01L21/324 主分类号 H01L21/205
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