发明名称 COOLING PLATE
摘要 PROBLEM TO BE SOLVED: To obtain an inexpensive cooling plate which is capable of improving a rate of convective heat transfer from the inner surface of the cooling plate to the cooling medium, in a cooling member which indirectly cools down an electronic apparatus in which heating electronic parts are mounted inside. SOLUTION: A thin plate 3b provided with projections 6 is internally inserted into the cooling medium passage of a thin-wall flat plate 3a that constitutes the cooling plate, so as to induce some of the cooling medium flowing in the cooling medium passage to flow toward the inner surface of the cooling plate, so that a rate of convective heat transfer from the inner surface of the cooling plate to the cooling medium can be improved, and the cooling plate can be configured at a low cost. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007250753(A) 申请公布日期 2007.09.27
申请号 JP20060071006 申请日期 2006.03.15
申请人 MITSUBISHI ELECTRIC CORP 发明人 KOBAYASHI YUTAKA
分类号 H05K7/20;H01L23/473 主分类号 H05K7/20
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