发明名称 METHOD FOR FORMING CONDUCTIVE PATTERN AND ELECTRONIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method for forming conductive pattern without deterioration in shape accuracy of printing patterns with initial formation of printing when selectively forming conductive patterns on the printing pattern. SOLUTION: A printing pattern 9a formed of a first silane coupling material to be coupled with palladium is formed on the front surface of a substrate 11. A coating film 13 is formed through coupling with a second silane coupling material not coupled with palladium to the front surface of the substrate 11 exposed from the printing pattern 9a. A palladium layer 15 is selectively formed on the printing pattern 9a. A conductive pattern 17 is formed on the palladium layer 15 by selectively forming a conductive material. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007250615(A) 申请公布日期 2007.09.27
申请号 JP20060068764 申请日期 2006.03.14
申请人 SONY CORP 发明人 TANAKA MASANOBU;KAMEI TAKAHIRO
分类号 H05K3/18 主分类号 H05K3/18
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