RESIN COMPOSITION AND METHOD FOR FORMING RELIEF PATTERN USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a resin composition carrying out a heat treatment at a low temperature of≤250°C and having excellent crack and peel resistances to a treatment with an organic chemical. SOLUTION: The resin composition is characterized by comprising (a) a polyimide precursor and/or a polybenzoxazole precursor, (b) metal compound particles and (c) a heat acid generator. COPYRIGHT: (C)2007,JPO&INPIT