发明名称 |
Semiconductor device and method for forming the same |
摘要 |
A semiconductor device may include a semiconductor substrate having a first dopant type. A first semiconductor region within the semiconductor substrate may have a plurality of first and second portions ( 44, 54 ). The first portions ( 44 ) may have a first thickness, and the second portions ( 54 ) may have a second thickness. The first semiconductor region may have a second dopant type. A plurality of second semiconductor regions ( 42 ) within the semiconductor substrate may each be positioned at least one of directly below and directly above a respective one of the first portions ( 44 ) of the first semiconductor region and laterally between a respective pair of the second portions ( 54 ) of the first semiconductor region. A third semiconductor region ( 56 ) within the semiconductor substrate may have the first dopant type. A gate electrode ( 64 ) may be over at least a portion of the first semiconductor region and at least a portion of the third semiconductor region ( 56 ).
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申请公布号 |
US2007221967(A1) |
申请公布日期 |
2007.09.27 |
申请号 |
US20060390796 |
申请日期 |
2006.03.27 |
申请人 |
KHEMKA VISHNU K;BOSE AMITAVA;ROGGENBAUER TODD C;ZHU RONGHUA |
发明人 |
KHEMKA VISHNU K.;BOSE AMITAVA;ROGGENBAUER TODD C.;ZHU RONGHUA |
分类号 |
H01L29/78;H01L21/336 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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