| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device for easily improving performance of a transistor. <P>SOLUTION: The semiconductor device is provided with a semiconductor chip on which the transistor is formed, first mold resin for resin-sealing a surface-side of the semiconductor chip, and second mold resin for resin-sealing a rear-side of the semiconductor chip. A thermal expansion coefficient of first mold resin differs from that of second mold resin. The semiconductor chip is physically bent by a difference of contraction force when first and second mold resins are cooled. Distortion is introduced into a channel region of the semiconductor chip. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
